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微电子封装已成为当今微电子制造中影响生产效率和器件性能的关键技术。超声键合是最为重要的芯片封装方法与技术,目前企业生产的90%以上芯片是采用超声键合法进行封装。超声波换能器是在微电子制造超声键合工艺中的一个重要部件,超声换能器的设计与动态特性分析是非常重要的。为了得到最大的振动幅值,变幅杆固有频率应和超声波发生器的工作频率相同。通过本文对超声换能器的研究、分析与设计,对于获得理想的超声波换能器具有很强的指导意义。
Microelectronic packaging has become the key technology in today’s microelectronics manufacturing that affects productivity and device performance. Ultrasound bonding is the most important chip packaging methods and technologies, the current production of more than 90% of the chips are packaged by ultrasonic bonding method. Ultrasonic transducers are an important part of the ultrasonic bonding process used in the manufacture of microelectronics. The design and dynamic analysis of ultrasonic transducers are very important. In order to get the maximum vibration amplitude, the natural frequency of the horn should be the same as the working frequency of the ultrasonic generator. The ultrasonic transducer research, analysis and design through this article have very strong guiding significance for obtaining the ideal ultrasonic transducer.