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采用真空压力浸渍法制备了碳化硅颗粒增强铸造镁合金（ＺＭ５）复合材料，碳化硅颗粒的平均尺寸为４μｍ，体积分数为４５％。通过透射电镜（ＴＥＭ）、能量色散谱仪（ＥＤＳ）研究了这种复合材料的ＳｉＣＰ／Ｍｇ界面微结构。实验结果表明：碳化硅颗粒与镁基体的界面结合紧密，界面区域存在合金元素铝的偏聚，并形成块状和细针状γ（Ｍｇ１７Ａｌ１２）相，这种γ相提高了界面结合强度。在ＳｉＣＰ／Ｍｇ界面区域存在高密度的位错缠结，这将对复合材料整体强度的提高作出贡献。另外，在有些ＳｉＣＰ／Ｍｇ界面上观察到氧化镁微晶层以及较大的氧化镁颗粒。
Silicon carbide particle reinforced cast magnesium alloy (ZM5) composite was prepared by vacuum pressure impregnation. The average size of silicon carbide particles was 4μm and the volume fraction was 45%. The SiCP / Mg interfacial microstructure of the composites was investigated by transmission electron microscopy (TEM) and energy dispersive spectroscopy (EDS). The experimental results show that the interface between silicon carbide particles and magnesium matrix is tightly bonded, the segregation of alloying element aluminum in the interface region and the formation of massive and fine needle-shaped γ (Mg17Al12) phase, which increase the interfacial bonding strength. There is a high density of dislocation tangles in the SiCP / Mg interface region, which will contribute to the overall strength of the composite. In addition, magnesium oxide microcrystalline layers and larger magnesium oxide particles were observed on some SiCP / Mg interfaces.