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11月17日,韩国现代(Hynix)半导体公司对外表示,它已经与总部位于日内瓦的意法半导体公司(S TMicroelectronics)签订了合作协议。 双方同意联合斥资20亿美元在江苏省无锡市合资组建一家存储芯片硅晶圆加工厂。现代称,该合资公司投资额为20亿美元,合作双方将各出5亿美元,中国金融机构将提供另外的10亿美元。现代将拥有该合资公司67％的股份,其余的股份则归ST所有。两家公司表示,新建工厂将生产动态随机存取存储芯片(DRAM)及NAND闪存芯片。NAND
On November 17, South Korea’s Hynix Semiconductor said it has signed a cooperation agreement with S TMicroelectronics, a Geneva-based company. Both parties agreed to jointly invest 2 billion U.S. dollars in a joint venture to set up a memory chip silicon wafer processing plant in Wuxi, Jiangsu Province. Hyundai said the joint venture will have a total investment of 2 billion U.S. dollars, each of the two parties will make 500 million U.S. dollars each and China’s financial institutions will provide another 1 billion U.S. dollars. Hyundai will own 67% of the joint venture and the rest will be owned by ST. The companies said the new plant will produce DRAM and NAND flash memory chips. NAND