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制作尺寸小到1微米的构件是电气、光学和机械系统朝着提高复杂性和微型化方向发展的一个关键问题。微结构工艺从半导体工业的研究中已经获得很多好处,通过这种研究,平面半导体表面的微型制作已发展成一种高度发展的技术。半导体工艺以连续应用掩模工艺为基础,该种工艺控制着材料的淀积,并以很高的空间分辨率进行清除操作。虽然,这些工艺过程非常适用于同一平面型器件的大量生产,但是它们不很适用于非平面表面的操作,也不适用于表面组成和几何形状需有灵活性的场合。
Building components down to 1 micron in size is a key issue for electrical, optical and mechanical systems toward increasing complexity and miniaturization. Microstructured processes have gained a great deal of benefit from the research in the semiconductor industry through which miniaturization of planar semiconductor surfaces has evolved into a highly developed technology. The semiconductor process is based on the continuous application of a mask process that controls the deposition of the material and carries out the cleaning operation with a high spatial resolution. Although these processes are ideally suited for the mass production of the same planar devices, they are not well suited for non-planar surface operations and are not suitable for applications where the surface composition and geometry need to be flexible.