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随着半导体工业的迅速发展，印刷电路板（ＰＣＢ）故障的检测和诊断已经成为ＰＣＢ制造过程中的一个核心问题。本文介绍了红外热成象技术（ＩＩＴ）检测ＰＣＢ故障的原理。详细分析了ＩＩＴ对各种ＰＣＢ故障的检测和诊断能力，并与传统的自动测试设备（ＡＴＥ）作了比较。由于ＩＩＴ检测的非接触性和直观性，ＩＩＴ可望成为ＰＣＢ制造中一种有效的质量保证手段。
With the rapid development of the semiconductor industry, the detection and diagnosis of printed circuit board (PCB) faults have become a core issue in the PCB manufacturing process. This article describes the principle of infrared thermal imaging (IIT) to detect PCB faults. The ability of IIT to detect and diagnose various kinds of PCB faults is analyzed in detail, and compared with the traditional automatic test equipment (ATE). Due to the non-contact and intuitive IIT detection, IIT is expected to be an effective quality assurance tool in PCB manufacturing.