今年3月国家发展改革委发布了关于含氰电镀工艺的调整说明的第21号令,规定到2014年底,用一种丙尔金工艺全面替代氰化亚金钾电镀工艺。近来,此规定引起了电镀界,特别是电子电镀界的强烈反响。对此,上海市电子学会电子电镀专业委员会草拟了一份意见建议书,拟报送发改委产业协调司,陈 In March this year, the National Development and Reform Commission issued Order No. 21 on the adjustment instructions for cyanide plating process, which stipulates that by the end of 2014, a complete substitution of gold plating process for gold potassium cyanide with a gold plating process will be provided. Recently, this provision has caused a strong reaction in the electroplating industry, especially in the electroplating industry. In this regard, Shanghai Institute of Electronics Electronic Plating Professional Committee drafted a proposal for proposals to be submitted to the NDRC Industry Coordination Division, Chen