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随着电路板以及元器件几何尺寸的缩小,印刷电路板装配中的质量控制水平也越来越重要。同时,这些尺寸很小的元器件非常脆弱,对贴放设备的挑战也越来越严峻。在线自动光学检验系统(AOI)可以在器件贴放完成之后进行检验、核查和测量,对于大多数标准的电路板结构而言,这样的系统有助于保证产品质量。而坐标测量机(CMM)对工艺过程的定量分析可以保证贴片过程处于最佳状态,这样AOI就可以对工艺过程的质量进行评估。上述这两种工艺过程的定性和定量分析对整个工艺控制中而言都必不可少。
As board and component geometries shrink, the level of quality control in printed circuit board assembly becomes more and more important. At the same time, these small components are very fragile, the challenges posed by the placement equipment is also more and more serious. On-line AOIs can be inspected, verified and measured after the device is placed and placed on top of it. For most standard circuit board configurations, such systems help ensure product quality. The CMM’s quantitative analysis of the process ensures that the placement process is in the best condition so that the AOI can evaluate the quality of the process. Qualitative and quantitative analyzes of these two processes are essential to the overall process control.