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对CuCr50触头材料的优化热处理工艺进行了研究。结果表明 ,固溶后再时效处理的CuCr50的电导率、硬度高于只进行时效处理的试样 ,优化热处理工艺为 960℃固溶 30min后 530℃时效 3h ,硬度 12 8HB ,电导率为 19 0m·(Ω·mm2 ) - 1,此时Cu基体中过饱和的Cr以细小、点状质点大量均匀弥散析出 ,时效温度过高或过低 ,时间过长或过短 ,均不利于性能的提高 ,热处理前后CuCr50的含氧量变化不大
The optimal heat treatment process of CuCr50 contact material was studied. The results show that the electrical conductivity and hardness of CuCr50 after re-aging treatment are higher than that of the aging-treated CuCr50. The optimized heat treatment process is as follows: solution treatment at 960 ℃ for 30min, aging at 530 ℃ for 3h, hardness 12 8HB, conductivity 19 0m · (Ω · mm2) -1. At this time, the supersaturated Cr in the Cu matrix is uniformly dispersed and precipitated in a large amount in the Cu matrix. The aging temperature is too high or too low, the time is too long or too short, which is unfavorable to the improvement of performance , CuCr50 oxygen content before and after heat treatment changes little