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离子镀是一种等离子体沉积技术。就镀层的附着力、凝聚力以及形貌生长而言,该工艺中,气体和蒸发材料的离子在镀层的形成过程中起着决定性的作用。镀材料范围主要决定于蒸发源的选配。根椐蒸发源的类型、气体介质和迁移方式,本文将讨论下述内容:电阻、电子束、活化离子束蒸发源以及溅射。典型的离子镀的离化原子的百分数由辉光放电时的离化率和蒸发剂的能量决定。镀流(the plating flux)由少量的高能离子和大量的中性粒子组成。镀流的能量分布范围是从热能到施加的放电伏特数之间变化。人们还不甚了解产生较大的附着力的各种反应机理,即一个带梯度成分的基材和镀层的介面层的形成机理,然而对其控制因素却作过评述。例如,结构形貌的变化影响镀层的力学性能和摩擦性能。通过结构形貌的变化来解释工艺变量对成核和生长特性的影响。
Ion plating is a plasma deposition technique. In terms of adhesion, cohesion and topography of the coating, the ions of the gas and the evaporated material play a decisive role in the formation of the coating in this process. The scope of plating material mainly depends on the matching of the evaporation source. In this article, the following topics are discussed: resistance, electron beam, activated ion beam evaporation source, and sputtering, depending on the type of evaporation source, the gas medium, and the mode of migration. The percentage of ionized atoms of a typical ion plating is dictated by the rate of ionization at the glow discharge and the energy of the vaporizer. The plating flux consists of a small amount of high-energy ions and a large amount of neutral particles. The energy distribution of the plating flow varies from thermal energy to the number of applied volts. There is still little understanding of the various reaction mechanisms that give rise to greater adhesion, namely the formation mechanism of the interface layer of a substrate with a graded composition and a coating, however, the controlling factors have been reviewed. For example, changes in the structure of the coating affect the mechanical properties and friction properties. The effect of process variables on the nucleation and growth characteristics is explained by the change of the structure topography.