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运用热力学和动力学的氧化原理,对焊料合金粉熔化时的氧化过程进行了分析。研究结果表明,在Sn-Pb焊料合金粉和Sn-Ag-Cu无铅焊料合金粉的氧化过程中,对Sn的氧化而言,其氧化产物主要是SnO2;对于Pb的氧化而言,主要生成PbO;Cu的氧化物主要是Cu2O,而Ag几乎不发生氧化。粉末中主要金属元素的氧化能力为:Sn>Pb>Cu。氧化速度随粉末粒度的细化和加热温度的升高而加剧,降低粉末界面的氧气浓度以及合理的熔化温度可降低氧化渣的形成率。
The oxidation process of melting solder alloy powder was analyzed by using the oxidation principle of thermodynamics and kinetics. The results show that the oxidation products of Sn-Pb solder alloy powder and Sn-Ag-Cu lead-free solder alloy powder are mainly SnO2 for the oxidation of Sn, and mainly for the oxidation of Pb PbO; the oxide of Cu is mainly Cu2O, and Ag hardly undergoes oxidation. The oxidation ability of the main metal elements in the powder is: Sn> Pb> Cu. The oxidation rate aggravates with the refinement of the powder particle size and the heating temperature. Reducing the oxygen concentration at the powder interface and a reasonable melting temperature can reduce the formation rate of the oxidized slag.