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伴随着电子产品的技术高速发展,印制电路板(简称PCB)电镀镀铜均匀性的要求越来越高,本论文综述通过改善电镀条件和调整镀液的组成以提高PCB均匀性的方法,并探索表面活性剂对PCB均匀性的影响。通常把在绝缘基材上,按预定设计,印制元器件和元器件之间电气连接的导电电路或者线路的成品板称为印制电路板(Printed Circuit
With the rapid development of the technology of electronic products, the requirements for uniformity of copper plating on printed circuit boards (referred to as PCB) are getting higher and higher. This paper reviews the methods of improving PCB uniformity by improving the plating conditions and adjusting the composition of the plating solution, And explore the effect of surfactants on PCB uniformity. Printed circuit boards (Printed Circuit Boards) are generally referred to as finished boards of electrically conductive circuits or circuits that are electrically connected on the insulating base material according to a predetermined design and printed with the components and components