论文部分内容阅读
采用三维弹塑性有限元分析方法，数值分析了胶焊接头中胶粘剂厚度和弹性模量对胶焊接头内应力分布的影响。给出了五种不同弹性模量和五种不同厚度胶粘剂下，胶焊接头中焊点边缘和搭接区边缘的应力分布曲线。结果表明：胶粘剂的弹性模量低和厚度大时，胶层中的剪应力小而焊点边缘处存在明显的应力集中；胶粘剂弹性模量增大和胶层厚度减小时，接头中焊点边缘处应力减小而胶层中剪应力增大。在一定条件下，胶焊接头中采用易变形的胶粘剂对提高胶焊接头的承载能力有利，可选择低弹性模量的胶粘剂和较厚的胶层厚度。
Using three-dimensional elasto-plastic finite element analysis method, the influence of the thickness and elastic modulus of the adhesive on the stress distribution in the adhesive bonding was numerically analyzed. The stress distribution curve of the edge of the solder joint and the edge of the overlap zone in five kinds of adhesive with different elastic modulus and five different thicknesses is given. The results show that when the elastic modulus of the adhesive is low and its thickness is large, the shear stress in the adhesive layer is small and there is obvious stress concentration at the edge of the solder joint. When the elastic modulus of the adhesive increases and the thickness of the adhesive layer decreases, The stress decreases and the shear stress in the layer increases. Under certain conditions, the use of a deformable adhesive in the plastic welding joint is advantageous for improving the bearing capacity of the plastic welding joint, and the choice of a low-modulus adhesive and a thicker layer thickness.