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采用金相显微镜(OM)、扫描电镜(SEM)和高分辨透射电镜(HRTEM)对Cu-4Ti-0.05RE和Cu-4Ti-0.12Zr-0.05RE两种合金的微观组织进行观察。对比分析发现添加Zr元素会抑制时效过程中形成片层组织(即延缓过时效的发生);两种合金在峰值时效时析出相均为亚稳的β′-Cu4Ti相,而在过时效状态下均会出现稳定的β-Cu3Ti相。采用显微硬度计和电导率测试仪分别研究两种合金在时效过程中显微硬度和电导率的变化规律。发现Cu-4Ti-0.05RE合金在450℃,6h达到峰值时效,此时合金的显微硬度HV是3150MPa,电导率是11.99%IACS;而Cu-4Ti-0.12Zr-0.05RE合金在450℃,8h达到峰值时效,此时合金的显微硬度HV是3350MPa,电导率是11.41%IACS。
The microstructures of Cu-4Ti-0.05RE and Cu-4Ti-0.12Zr-0.05RE alloys were observed by OM, SEM and HRTEM. The comparative analysis shows that the addition of Zr can inhibit the formation of lamellar structure (ie, delay the occurrence of over-aging) during the aging process. Both alloys exhibit metastable β’-Cu4Ti phases at peak aging, whereas in the over-aged condition Will appear stable β-Cu3Ti phase. Microhardness tester and conductivity tester were used to study the changes of microhardness and electrical conductivity of the two alloys during the aging process. The results show that the Cu-4Ti-0.05RE alloy reaches the peak age at 450 ℃ for 6h, the HV of the alloy is 3150MPa, the conductivity is 11.99% IACS, while the Cu-4Ti-0.12Zr- 8h peak aging, when the alloy microhardness HV is 3350MPa, conductivity is 11.41% IACS.