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本文结合多层聚酰亚胺和多层低温共烧陶瓷结构，描述了多芯片组件（ＭＣＭ）的制作工艺，多层低温共烧陶瓷用作封装基在。还报道了这种组件的主要特性。
In this paper, multi-layer polyimide and multi-layer low-temperature co-fired ceramic structure, described the multi-chip module (MCM) manufacturing process, multi-layer low temperature co-fired ceramic used as a package base. Also reported the main features of this component.