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采用Cu箔与Ag-Cu-Ti3钎料在880℃、10 MPa及不同保温时间下对Ti(C,N)基金属陶瓷/40Cr钢进行真空扩散连接,利用光学显微镜、扫描电镜和能谱仪对不同保温时间下接头及其断面微观组织进行了分析。结果表明:随保温时间的延长,接头中金属间化合物因向周围组织扩散而逐渐减少,当保温时间延长至60 min时,接头组织主要为Cu基固溶体;接头断面由近陶瓷侧焊缝区有块状Ti-Cu化合物分布处启裂,并向周围组织扩展,最后跨过界面直至陶瓷基体。
Ti (C, N) -based cermets and 40Cr steels were vacuum-diffused and connected by Cu foil and Ag-Cu-Ti3 brazing filler metal at 880 ℃, 10 MPa and different holding time. The microstructures were characterized by optical microscope, SEM and EDS The microstructures of joints and their sections under different holding time were analyzed. The results show that with the increase of holding time, the intermetallic compounds in the joint gradually decrease due to diffusion to the surrounding tissues. When the holding time is extended to 60 min, the joints mainly consist of Cu-based solid solution; The bulk Ti-Cu compound cracked at the distribution and spread to the surrounding tissue, finally crossing the interface up to the ceramic matrix.