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在半导体封装技术发展史上,1990年成立的Tessera以其授权的封装技术(CSP封装到最新的3DIC封装)成功居于领导地位。为了拓展业务成长的空间,该公司在2005年间切入手机相机模块市场,藉并购技术独到的光学封装与软件厂商,状大在光学技术领域的发展地位。为能了解Tessera何以由奠基的IC封装业跨足光学领域,该公司如何运筹帷握产品策略的成功,透过本次专访两大部门主管,相信能有清楚的轮廓。
In the history of semiconductor packaging technology, Tessera was founded in 1990 as a leader in its proven packaging technology (CSP to latest 3DIC package). In order to expand the business growth of space, the company cut into the mobile phone camera module market in 2005, by the acquisition of unique optical packaging technology and software vendors, big in optical technology development status. To understand how Tessera’s groundbreaking IC packaging industry has spanned the field of optics, how successful the company is in strategizing its product strategy, I believe there is a clear outline of the two major departmental executives in this interview.