概述近年来,随着我国硅材料加工技术的不断发展,人们对晶片加工过程中的加工质量及检测方法已愈来愈引起重视。加工过程中的质量检测已变得十分重要了。其中表征晶片加工参数的几个重要几何参数——弯曲度、厚度和总厚度变化的检测及检测方法尤为硅片生产厂 In recent years, with the continuous development of silicon material processing technology in our country, people have paid more and more attention to the processing quality and testing methods in the process of wafer processing. Quality inspection in the process has become very important. One of the several important geometric parameters that characterize the processing parameters of wafers, such as the testing and testing methods of curvature, thickness and total thickness change,