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前言 图象转移是PCB生产过程中的关键步骤。随着HDI板和微导通孔板的生产实践以及普通印制板生产技术的提高,传统的接触成像已不能满足高水平的技术要求,而且传统的曝光设备也已经不能满足生产中对照相底版、连接盘、导通孔、定位精确度、图形重合度的要求。基于上述需求,新型的以激光为基础的成像技术以及其他的成像技术已经开始逐步取代传统的接触成像技术。
Introduction Image transfer is a key step in PCB production. With the production of HDI board and micro-via plate and the improvement of production technology of ordinary PCB, the traditional contact imaging can not meet the high level of technical requirements, and the traditional exposure equipment can no longer meet the requirements of the production of phototypesetting , Connection pads, vias, positioning accuracy, the degree of overlap of graphics requirements. Based on the above requirements, the new laser-based imaging technology and other imaging technologies have begun to gradually replace the traditional contact imaging technology.