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快速电镀详名叫快速笔涂电镀(又称涂镀),是近几年来发展的新工艺。其基本工作原理,如图所示. 工件接电源的负极,镀笔接电源的正极,靠浸镀液的镀笔在工件表面上擦拭而获得电镀层.镀笔和工件做相对运动,工件表面上的各点在镀笔与其接触时发生瞬时放电结晶,从而形成镀层。军工、铁路系统对快速电镀的应用较早,效果良好。1982年西山、韩城等矿务局
Rapid plating known as the rapid pen coating plating (also known as Tu), is the development of new technology in recent years. The basic working principle, as shown in the figure. The workpiece is connected to the negative power supply, plated pen connected to the positive power supply, by dipping liquid plating pen wipe the surface of the workpiece and get the plating layer. Pen plating and the workpiece to do relative movement, the workpiece surface The various points on the plating pen in contact with its instantaneous discharge crystallization occurs, thus forming a coating. Military, rail system for the rapid application of electroplating earlier, the effect is good. 1982 Xishan, Hancheng Mining Bureau