硅集成电路的发展趋势硅集成电路的发展趋势有集成度提高、园片直径增大、特征尺寸减少、功耗增大、互连线层数增多等。目前,以0.25微米 CMOS 技术为主流的微电子技术已经进入大生产阶段,芯片的集成度达到10~8～10~9量级。预计到2006年,单片系统集成芯片将达到如下指 Development trend of silicon integrated circuits Silicon integrated circuits have increased the trend of integration, increase the diameter of the wafer, feature size reduction, power consumption increases, the number of interconnection lines increased. At present, the microelectronics technology mainstreaming 0.25-micron CMOS technology has entered the large-scale production stage, and the chip integration level reaches 10-8 to 10-9. It is estimated that by 2006, the monolithic integrated circuit chip will reach the following points