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目前,工业与民用电子设备技术革新仍在快速发展着。由于片状元件品种增多及在产业设备领域的普及,考虑降低产品总成本已提到日程上来了。在印制板上各种元件的安装技术,尤其是片状元件贴装技术受到人们重视的今天,必须解决焊膏材料、印刷技术再流焊装置等问题。本文主要介绍已被广泛采用的再流焊装置——红外线加热再流焊装置的现状及技术课题。
At present, the technological innovation of industrial and civilian electronic devices is still rapidly developing. Due to the increasing number of chip components and their popularity in the field of industrial equipment, it has been mentioned that the total cost of product has been reduced to the agenda. In the printed board on the various components of the installation technology, especially the chip-mounted components technology has attracted people’s attention today, we must address the solder paste materials, printing technology, reflow soldering equipment and other issues. This article mainly introduces the current situation and technical topics of the reflow soldering equipment that has been widely used - infrared heating reflow soldering equipment.