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目前,具有更高互连密度的积层式多层板在BGA(Ball Grid Array)、MCM(MultichipModule)和CSP(Chip Scale Package)等互连电路中得到了迅速的普及和广泛地应用。并进一步把积层多层板推广到倒芯片(flip chip)封装的领域中应用,从而推动积层式多层板继续向更高密度的发展。这样一来,积层式多层板的盲孔加工孔数越来越多,其单面,一般在20,000～70,000个孔左右,甚至高达100,000个孔或更多。对于如此多的盲孔加工数量,除了采用已述的光致法(photo-via)和等离子体法(Plasma-via)来制造盲孔(blind-via)外,特别是随着盲导通孔孔径越来越小(如<Φ0.10mm的microvia)时,采用激光法(Laser-via)来
At present, multilayer boards with higher interconnect density have been rapidly popularized and widely used in interconnection circuits such as Ball Grid Array (BGA), Multichip Module (MCM) and Chip Scale Package (CSP). And further promote the application of laminated multilayer boards in the field of flip chip packaging, thereby promoting the continuous development of multilayer multilayer boards to higher density. As a result, the number of blind holes in laminated multilayer boards increases, with one side, typically around 20,000 to 70,000 holes, or even up to 100,000 holes or more. For such a large number of blind hole processes, in addition to the blind-via fabrication using the photo-via and plasma-via methods described above, in particular with blind via holes With smaller and smaller apertures (eg microvia of <Φ0.10mm), laser-based