论文部分内容阅读
鉴于电路板生产过程中环保和成本的要求,采用唑类缓蚀剂取代传统的锡铅合金镀层以保证可焊性。探讨了唑类缓蚀剂的保护机理、应用情况及发展前景。
In view of environmental protection and cost requirements in the circuit board production process, the use of azole corrosion inhibitors to replace the traditional tin-lead alloy coating to ensure solderability. The protection mechanism, application and development prospects of azole corrosion inhibitors were discussed.