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一、再流焊设备和原理再流焊种类较多,包括幅射、对流、气相等,其原理和特点不尽相同。这里仅对一种较典型的日制再流焊炉(TCW—118)及其配套设备作一介绍。 1、TCW—118再流焊炉这是一种效率极高的再流焊装置。它能把扁平式LSI、SI和片晶体、片电容等片状元件和部件装焊在一块高密度化的混合电路板或印制板上。该装置采用一种不锈钢网状的薄型传输带,使热量从钢带下面的加热板传向钢带上面焊膏覆盖的工件,然后进行再流焊操作。控制箱可准确方便地控
First, the reflow equipment and principles Reflow welding more types, including radiation, convection, gas phase, the principles and characteristics vary. Here only a more typical day reflow oven (TCW-118) and its ancillary equipment to make an introduction. 1, TCW-118 reflow oven This is a highly efficient reflow soldering device. It can be flat LSI, SI and chip crystal, chip capacitors and other chip components and components mounted on a high-density hybrid circuit board or printed circuit board. The unit uses a thin, stainless steel mesh belt that transfers heat from the hot plate beneath the strip to the work piece covered by the strip over the strip, followed by a reflow operation. Control box can be accurately and conveniently controlled