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据SEMI最新的光电/LED全球晶圆厂数据预测,继2011年的设备支出猛增36%之后,2012年全球LED制造设备支出预计下降18%,而制造能力有望达到200万片(以每月4寸计),较2011年增长27%。受中国政府鼓励及经济发展投资的刺激,电视背光应用中的高亮度发光二极管(HB-LED)在过去数年内推动产能迅速扩张。但2012年全球MOCVD设备采购方面40%的降幅将使LED设备总体支出五年多以来首次出现下滑。然
According to SEMI latest optoelectronics / LED global fab data forecasting, after a 36% surge in equipment spending in 2011, the global LED manufacturing equipment spending in 2012 is expected to decline 18%, while manufacturing capacity is expected to reach 2 million (monthly 4-inch meter), an increase of 27% over 2011. Encouraged by the Chinese government’s encouragement and investment in economic development, the high brightness light-emitting diode (HB-LED) in TV backlight applications has driven the rapid expansion of production capacity in the past few years. However, a 40% decline in procurement of MOCVD equipment worldwide in 2012 will result in the first decline in overall spending on LED equipment in more than five years. Of course