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随着智能型手机、平板计算机的崛起,小、快、轻、省电成为移动装置趋势,推升对三维芯片(3DIC)的需求大增,开启半导体产业一轮新竞赛。晶圆代工厂台积电已为可程序逻辑芯片大厂智霖(Xlinx)量产FPGA芯片,联电及封测厂日月光、矽品、力成也加入量阵容;设备厂弘塑、均华及力积的封装接合设备,也导入客户验证中。日本索尼(SONY)最新的旗鉴款防水手机XperiaZ,就已采用3DIC制程的影像传感器芯片,成为影像感测芯片的新标竿。3DIC制程所缔造的三高效益:高效能、高密度及高可移植性,发挥引领风潮的效应,改变半导体业界的思维,台湾各厂商积极抢进影像传感器立体堆叠市场。台湾工研院电光所所长刘军廷表示,荣获院内今年度推广服务奖金牌奖的
With the rise of smart phones and tablet computers, small, fast, light and power-saving devices have become the trend of mobile devices, boosting the demand for 3D ICs and opening up a new round of competition in the semiconductor industry. Foundry TSMC has a programmable logic chip maker Zhi Lin (Xlinx) production FPGA chips, UMC and IC packaging and testing plant ASE, Si products, Li Cheng also join the lineup; equipment plant Hong Plastic, both Chinese and Li Ji Package bonding equipment, but also into customer verification. Japan’s Sony (SONY) latest flagship models waterproof phone XperiaZ, has adopted the 3DIC process image sensor chip, a new benchmark for image sensor chip. 3DIC manufacturing process created by three high-efficiency: high efficiency, high density and high portability, play the leading wave of the effect of changing the thinking of the semiconductor industry, Taiwan manufacturers actively grab the image sensor three-dimensional stacking market. Liu Jun-ting, director of Taiwan’s ITRI Institute of Optics and Optoelectronics, said that he has won the Gold Medal Award for this year’s Promotion Service Award