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温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度。针对温度循环载荷下软钎焊焊点界面空洞损伤的失效行为特点 ,结合焊点内部应力—应变场分布特征及其温度历史相关性 ,提出了相对损伤应力这一概念 ,并以此作为温度循环载荷下软钎焊焊点失效的主控力学因素。分析了温度历史不同阶段对焊点失效行为的影响 ,结果表明高温保温阶段焊点内部最容易发生空洞损伤。
Temperature cycling loads can create a high stress triaxiality at the weld joint interface that is sufficient to cause cavitation damage. In view of the failure behavior of the hole damage at the interface of solder joints under temperature cyclic loading, the concept of relative damage stress is put forward based on the distribution characteristics of stress-strain field inside the solder joint and its temperature history. Main controlling mechanical factors of solder joint failure under load. The influence of different stages of temperature history on the failure behavior of the solder joint is analyzed. The results show that the hollow damage is most likely to occur inside the solder joint during the high temperature thermal insulation stage.