论文部分内容阅读
在贝尔公司里,半导体器件可靠性发展的历史是一个顺序应用下列原则的历史。第一个原则是采用工艺来提高可靠性。这个原则是在缺乏完善有见识的设计和试验控制时采用的。第二是应用试验控制原则,这是在对于工艺缺陷的认识逐渐加深,以及了解到容易用试验来揭露这些缺陷之后所采用的原则。第三是应用设计控制原则,这个原则是建立在成熟的工艺及基本上自动消除了由操作所引入的缺陷的基础上。几十年来,半导体生产的设计和可靠性技术中一般也就应用这些原则。五十年代可以看成新器件设计研究阶段,这时期还没有对可靠性提出真正严格的要求。事实上,这个时期的历史表明,半导体器件比适当试验技术条件所能证明的要好。尽管这时期贝尔实验室促进可靠性进展之一就是应用抽样方法,这个方法能保证用户所买的元件的统计可靠性。六十年代第一件事是能经受高应力试验的扩散器件投入生产。第二件事是应用了高应力老化和寿命试验来控制质量,这种高应力试验和低应力应用条件下所予期的可靠性是有严格关系的。促使高应力试验的发展推动力来源于两个方面:一是需要低失效率的器件,二是认识到象低达一千小时约有0.001%的器件失效的失效率是不能靠使用条件下的应力来证实。七十年代的新技术是梁式引线密封结器件制造工艺。这就表明能够用设计方法来消除六十年代器件的主要失效机理。尽管这不需要去潮密封,但却产生另外问题,即需要论证器件和它的塑科涂复层承受高湿试验的能力。我们发现这种论证是服从用物理方法所建立的湿度、温度条件和器件寿命之间的关系的。成功地得出有效的器件试验要求和系统寿命指标之间的关系是归因于贝尔公司内部的组织关系。由于这个组织关系使器件设计人员既对于用户负责(用户即指系统设计人员,也就是说系统设计人员和器件设计者有共同的可靠性指标),也对器件生产部门负责。对于器件生产部门,器件设计者对工艺、工艺控制、以及满足系统指标的最后试验要求等问题应负有最经济的统筹考虑的责任。
At Bell, the history of semiconductor device reliability development is a history of the sequential application of the following principles. The first principle is the use of technology to improve reliability. This principle is used in the absence of well-informed design and test controls. The second is the application of the principle of experimental control, which is the principle behind the gradual deepening of awareness of technological defects and the understanding that it is easy to experiment with these defects. The third is the application of design control principles, which are based on proven processes and basically automatically eliminate the drawbacks introduced by the operation. For decades, these principles have generally been applied in the design and reliability technologies of semiconductor manufacturing. Fifties can be seen as a new device design and research stage, this period has not made the real rigorous requirements for reliability. In fact, the history of this period shows that semiconductor devices can prove better than the proper experimental conditions. Although one of Bell Labs’ efforts to promote reliability during this period is the application of sampling methods, this method guarantees the statistical reliability of the components purchased by the user. The first thing in the sixties was the proliferation of devices that could withstand high stress tests. The second is the application of high stress aging and life tests to control the quality. This high stress test is strictly related to the reliability expected under low stress conditions. The driving forces behind the development of high-stress tests are twofold: first, devices that require low failure rates; second, recognizing that failure rates of about 0.001% of devices as low as 1,000 hours can not depend on the conditions of use Stress to confirm. The new technology of the seventies is a beam lead seal junction device manufacturing process. This shows that design methodology can be used to eliminate the main failure mechanisms of the devices of the 1960s. Although this does not require a moisture seal, it creates the additional problem of demonstrating the ability of the device and its plastic coated layers to withstand high humidity testing. We find that this argument is based on the relationship between humidity, temperature conditions and device lifetime established by physical methods. The successful conclusion of the relationship between valid device test requirements and system life metrics is due to the company’s internal organizational relationships. Because of this organizational relationship, device designers are both user-responsible (users refer to system designers, that is, system designers and device designers have common reliability metrics) and are responsible for the device manufacturing department. For the device manufacturing department, device designers should have the most economical and overall responsibility for such issues as process and process control, as well as the final test requirements to meet system specifications.