Electronic components are normally assembled to printed circuit boards (PCBs). Such components generate heat in operation which must be conducted away efficient
Forced-air convection cooling of high-power electronic devices is widely used, but it has a problem that a rise in temperature of the air used to cool the upstr
In the present work, a numerical solution is described for turbulent forced convection flow of an absorbing, emitting, scattering and gray fluid over a two-dime