Experiment were conducted to unidirectional solidification pure copper during ECAP by route C, the samples were investigated by XRD and EBSD. The results shown that the effect of original microstructure on the subgrains orientation decrease with the increasing of strain. At low strain, in the column grain interiors first formed a band structure that the orientation quite different with the matrix. With the strain increasing, the boundaries of the band structure expanding towards to two sides, gradually partition the original column grains into subgrains, the distribution of the subgrains possesses a directional distribution characteristics and the twins occurring in subgrains. Keep on increasing strain, the original grain boundaries began to broken, low angles grain boundaries and high angles grain boundaries both occur simultaneously shows a diffusion distribution characteristics. Experiment were conducted to unidirectional solidification pure copper during ECAP by route C, the samples were investigated by XRD and EBSD. The results shown that the effect of the original microstructure on the subgrains orientation decrease with the increasing of strain. At low strain, in the column With the strain increasing, the boundaries of the band structure expanding towards to two sides, gradually partition the original column grains into subgrains, the distribution of the subgrains possesses a directional distribution characteristics and the twins occurring in subgrains. Keep on increasing strain, the original grain boundaries began to broken, low angle grain boundaries and high angles grain boundary both times simultaneously both a diffusion distribution characteristics.