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本文利用扫描电镜X射线能谱及X射线光谱分析,结合金相及试样逐层的X射线结构分析,剖析了Cu-Ti合金与石墨(或金刚石)粘结界面的微区组织结构;揭示了Cu-Ti合金对金刚石表面的浸润和粘结机理。即Cu-Ti合金中的Ti原子与石墨(或金刚石)表面的碳原子在高温下反应生成稳定的断续的TiC膜,Cu-Ti合金对金刚石的浸润和粘结是通过TiC来实现的。
In this paper, the microstructure of the interface between Cu-Ti alloy and graphite (or diamond) was analyzed by scanning electron microscopy (SEM) and X-ray spectroscopy (XRD), combined with metallographic and specimen-by-layer X-ray structure analysis Cu-Ti alloy on the diamond surface of the infiltration and bonding mechanism. That is, the Ti atoms in the Cu-Ti alloy react with the carbon atoms on the graphite (or diamond) surface to form a stable and intermittent TiC film at high temperature. The wetting and bonding of the Cu-Ti alloy to the diamond is achieved by TiC.