论文部分内容阅读
采用SEM观察等手段研究了Sn58BixEr(x=0,0.1,0.5;表示添加质量分数0.01%,0.5%的Er)/Cu钎焊接头界面反应以及在120℃时效过程中金属间化合物(IMC)的生长行为。实验结果表明:Sn58BixEr/Cu钎焊接头IMC层厚度随着钎焊温度的升高而增厚,添加微量的Er能够有效抑制界面IMC的生长。在时效过程中,界面IMC层的厚度随着时效时间的增加而逐渐增厚。通过对实验数据进行拟合,得出120℃时效温度下Sn58Bi0.1Er/Cu和Sn58Bi0.5Er/Cu的IMC层的生长速率常数分别为3.42×10–16 m2/s和2.84×10–16 m2/s。
The effects of Sn58BixEr (x = 0,0.1,0.5; adding Er at mass fraction of 0.5%) / interface of Cu braze joint and intermetallic compound (IMC) during aging at 120 ℃ were studied by SEM observation and other means. Growth behavior. The experimental results show that the thickness of IMC layer of Sn58BixEr / Cu brazed joint increases with the increase of brazing temperature. The addition of trace Er can effectively restrain the growth of IMC at interface. During the aging process, the thickness of IMC layer gradually increased with the aging time. By fitting the experimental data, the growth rate constants of IMC layer of Sn58Bi0.1Er / Cu and Sn58Bi0.5Er / Cu at 120 ℃ are 3.42 × 10-16 m2 / s and 2.84 × 10-16 m2 / s.