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本文介绍一种集成电路内引线球焊用金属丝成球装置。此装置采用受控脉冲放电的方式在企属丝端头烧制丝球焊所需的金属球。在氢气保护条件下,利用钢丝烧球时,可使球的几何形状规则,表面光滑;用铝丝烧球时,在规范适当的条件下,也可望得到良好的结果。文中指出,不仅烧球电压与金属丝球的形成有关,而且烧球电流对铜、铝丝成球的影响可能更大,这在粗丝烧球时表现更为明显。本文还对铜丝和铝丝球的焊球连接做了初步试验,试验结果表明这种连接是可以实现的。
This article describes a wire ball bonding integrated circuit ball into the ball device. This device uses a controlled pulse discharge method at the wire end firing wire ball welding the required metal ball. Hydrogen gas protection conditions, the use of wire burning ball, the ball geometry can make the rules, the surface smooth; with aluminum wire burning ball, under the proper conditions in the norms, is expected to get good results. The article pointed out that not only the burning ball voltage and the formation of metal wire ball, and the burning current ball copper, aluminum wire into the ball may be greater impact, which is even more pronounced in the wire burning ball. This article also made a preliminary test of the solder ball connection of copper wire and aluminum wire ball, the test results show that this connection can be achieved.