对比研究了直流磁控溅射(dcMS)、高功率脉冲磁控溅射(HPPMS)和调制脉冲磁控溅射(MPPMS)所沉积纳米晶TiN薄膜的组织结构与力学性能.结果 表明,因dcMS溅射粒子离化率与动能均较低,薄膜表现为存在少量空洞的柱状晶结构,薄膜力学性能差、沉积速率为51 nm/min.HPPMS因具有较高的瞬时离化率和较低的占空比,薄膜结构致密而光滑,性能得到了显著改善,但平均沉积速率较低,仅为25 nm/min.通过MPPMS技术可大范围调节峰值靶功率和占空比,从而得到较高的离化率和平均沉积速率,薄膜结构致密光滑、力学性能优异,沉积速率达45 nm/min,接近dcMS.“,”The structure and properties of nanocrystalline TiN films deposited by direct current magnetron sputtering (dcMS),high power pulsed magnetron sputtering (HPPMS) and modulated pulsed power magnetron sputtering (MPPMS) were compared.Results show that columnar structure with a few gaps is obtained through dcMS because of low ionization rate and low kinetic energy of sputtered species,which results in poor mechanical properties;the deposition rate is 51 nm/min.The TiN film deposited by HPPMS exhibits dense structure and smooth surface,which is because HPPMS can improve ionization rate of sputtered species under the conditions of high peak target power and low duty cycle.The mechanical properties are improved,but the average deposition rate is relatively low,only 25 nm/min.MPPMS has the capability to modulate peak target power and duty cycle to achieve high ionization degree and deposition rate.Thus,the TiN film deposited by MPPMS shows dense columnar structure,smooth surface,superior mechanical properties and enhanced deposition rate of 45 nm/min.