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采用有限体积数值模拟、瞬态热阻测试方法以及热沉温度—峰值波长变化的关系,对三种散热基板上大功率AlGaInP红光发光二极管(LED)进行热特性分析。三种LED采用相同型号、规格,散热基板,区别在于散热通道以及材料。测量样品的瞬态温度响应曲线,基于结构函数理论模型对温度响应曲线进行数学处理,得出包含热阻与热容的结构函数,区分出样品内部热流通道上各个区域的热阻与热容,进而发现散热瓶颈区域。测试样品在不同热沉温度下的电致发光光谱,通过热沉温度—峰值波长系数为区别样品散热性能提供定性判断依据。通过模拟与测试结果比较,为优化陶瓷基板内部散热结构,设计最佳的散热模型提供重要参考依据。
The thermal characteristics of high power AlGaInP red light emitting diodes (LEDs) on three substrates were analyzed by finite volume numerical simulation, transient thermal resistance test and the relationship between the temperature and peak wavelength. Three kinds of LED using the same model, size, thermal substrate, the difference is the cooling channels and materials. The temperature response curve of the sample was measured. Based on the theoretical model of structure function, the temperature response curve was mathematically processed to obtain the structure function including the thermal resistance and the heat capacity. The thermal resistance and heat capacity of each area of the sample were distinguished. Then find the cooling bottleneck area. The electroluminescence spectra of the test samples at different heat sink temperatures provide a qualitative basis for judging the heat dissipation performance of the samples by the temperature-peak wavelength coefficient of the heat sink. Through the comparison of simulation and test results, it provides important reference for optimizing the heat dissipation structure of ceramic substrate and designing the best heat dissipation model.