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由于黄金具有优良的导电性、可焊性和高稳定性(不易被氧化和腐蚀),所以在电子工业中被广泛应用作接插件镀层的原料.随着我国电子工业的蓬勃发展,对黄金的需求量也越来越大.据不完全统计,仅上海地区每年用于生产接插件的黄金达50千克以上. 为了节约黄金,降低成本,我校化学系电化学教研室受上海无线电二十厂的委托,就既具有高硬度而又能减薄镀层的印刷板电镀金钴合金工艺进行了深入研究.经过反复试
As gold has excellent conductivity, solderability and high stability (not easy to be oxidized and corroded), so in the electronics industry is widely used as a raw material of the connector plating.With the vigorous development of China’s electronics industry, the gold Demand is also growing.According to incomplete statistics, only the annual output of gold in the Shanghai area for the production of connectors up to 50 kilograms.In order to save gold, reduce costs, the Department of Chemistry Department of Chemistry by the Shanghai radio twenty factory Commissioned to both have a high hardness and can be reduced plating plating gold-cobalt alloy plating process conducted in-depth study. After repeated tests