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采用理论计算和试验相结合的方法研究了平均粒径为4~6μm的W粉等静压压制规律,利用压制理论分析了压坯密度与压制力之间的关系,并推导出了两者之间的关系式。并据此选择了合适的压制成型参数,通过高温烧结W骨架和熔渗的方法制备了Cu含量为15%的CuW复合材料。通过SEM观察了W骨架和复合材料的显微组织,并测量了密度、硬度和电导率。结果表明,平均粒径为4~6μm的W粉完全符合冷等静压压制压力与压坯密度的双对数方程,采用250MPa压力,经过1 850℃烧结W骨架后制备的CuW合金Cu含量为15%,硬度(HB)达到了221,电导率为21.98 MS/m,热导率为196 W·m~(-1)·K~(-1)。
The law of isostatic pressing of W powder with average grain size of 4 ~ 6μm was studied by theoretical calculation and experiment. The relationship between compact density and pressing force was analyzed by pressing theory, and the relationship between the two Relationship between. Based on the results, the proper compression molding parameters were selected and the CuW composite with Cu content of 15% was prepared by high temperature sintering W skeleton and infiltration. The microstructure of W skeleton and composite was observed by SEM and the density, hardness and electrical conductivity were measured. The results show that the average grain size of 4 ~ 6μm W powder in full compliance with the cold isostatic pressing pressure and compact density of the logarithmic equation, using 250MPa pressure, after the W skeleton sintered at 1 850 ℃ prepared CuW Cu content 15%, HB reached 221, conductivity 21.98 MS / m and thermal conductivity 196 W · m -1 K -1.