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评论宽带钢镀覆工艺的改进和发展,用使用量和不同的镀覆方法及不同材料的优缺点论述了各种镀层的现状。从材料成本高和需要保存的角度来说明赞成扩大使用电沉积工艺的理由,因为电沉积比热浸镀和粉末涂层能严格控制涂层厚度和提供较薄、较一致的薄膜。
Commenting on the improvement and development of the wide band steel plating process, the current situation of various coatings is discussed with the usage amount and different plating methods and the advantages and disadvantages of different materials. The reasons for the expanded use of electrodeposition processes are described in terms of material cost and need to be preserved because electrodeposited hot dip and powder coatings allow for tighter coating thickness control and the provision of thinner, more consistent films.