采用反应合成法结合塑性变形工艺制备了不同SnO2含量的AgCuOIn2O3SnO2电触头材料,利用扫描电镜和金相显微镜表征了材料的微观形貌及显微组织,分析对比了不同SnO2含量的材料金相组织及其增强相的分布均匀性,并利用X射线衍射分析了材料的物相结构.测量了材料的抗拉伸强度、硬度、电阻等性能.结果 表明:添加适量的SnO2能使组织中的孔隙尺寸缩小、其他缺陷明显减少.氧化物弥散分布在银基体中,极大地改善了AgCuOIn2O3电触头材料的显微组织均匀性.在SnO2含量不变时,材料的电阻率随塑性变形程度增加而有所降低;随着SnO2含量增多,电阻率呈现先降低后升高的趋势,最后趋于定值,约为2.4 μΩ·cm.添加SnO2后各试样材料的硬度均显著升高,SnO2含量为1％(质量分数)的材料具有最优的抗拉伸强度和延伸率.“,”AgCuOIn2O3SnO2 electrical contact materials with different SnO2 contents were prepared by reaction synthesis coupled with plastic deformation process.The morphology and microstructure of the AgCuOIn2O3SnO2 contact materials were characterized by scanning electron microscopy and optical microscope.The distribution uniformity of the metallographic structure and the reinforcement phase of the materials with different SnO2 contents was analyzed.The phase structure of the materials was measured by X-ray diffraction,and the tensile strength,hardness,and resistivity of the materials were also measured.Results show that the appropriate SnO2 addition can significantly decrease the pore size and reduce other defects in the structures.The diffusion of oxides in the silver matrix greatly improves the microstructure uniformity of AgCuOIn2O3 contact materials.When the SnO2 content is fixed,the resistivity of materials is decreased with conducting the plastic deformation;with increasing the SnO2 content,the resistivity is decreased firstly,then increased,and finally turns to be stable at 2.4 μΩ·cm.The hardness of the materials is increased significantly after SnO2 addition.The material with 1wt％ SnO2 shows the optimal tensile strength and elongation.