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江苏金陵机械制造总厂模块修理技术研究室以服务修理生产和科研为原则,重点开展国产及苏系列飞机机载电子设备微波模块基础性、前瞻性的高技术修理研究工作。积极进行各项修理技术研究,不断探索钻研技术创新,切实提高保障装备的可靠性。研究室以微组装工艺平台为基础,致力于各型微波组件多芯片模块组装(MCM-L)技术、表面贴装工艺、微组装工艺、基于低温共烧陶瓷(LTCC)基板的多芯片模块组装
Jiangsu Jinling Machinery Manufacturing Plant Module Repair Technology Services to repair the production and scientific research as the principle, focusing on the domestic and Soviet series aircraft airborne electronic equipment microwave module basic, forward-looking high-tech repair research. Actively carry out various repair technology research, continue to explore research into technological innovation, and effectively improve the reliability of the protection of equipment. Based on the micro-assembly process platform, the lab is dedicated to the assembly of various types of multi-chip module assembly (MCM-L) for microwave components, surface mount technology, microassembly process, multi-chip module assembly based on LTCC substrate