膜厚对直流磁控溅射Nb薄膜微结构的影响

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采用直流磁控溅射方法制备膜厚为50,100,200,400,600 nm的Nb薄膜,对薄膜的沉积速率、表面形貌、晶体结构进行了研究,并对其应力和择优取向进行了详细的分析。原子力显微镜图像显示Nb膜表面光滑、致密,均方根粗糙度达到0.1 nm量级。X射线小角衍射给出了薄膜的晶格结构、晶粒尺寸和应力情况。分析表明薄膜为多晶体心立方结构(bcc),在(110)晶面方向存在明显的择优取向,且随着薄膜厚度增大而增强。Nb膜应力先随薄膜厚度增大而增大,在200 nm时达到最大值(为1.0151 GPa),后随薄膜厚度的增大有所减小。 The Nb thin films with thickness of 50, 100, 200, 400 and 600 nm were prepared by DC magnetron sputtering. The deposition rate, surface morphology and crystal structure of the films were studied. The stress and preferred orientation were analyzed in detail. Atomic force microscopy images showed that the surface of Nb film was smooth and compact, and the root mean square roughness was on the order of 0.1 nm. X-ray small angle diffraction gives the lattice structure, grain size and stress of the film. The analysis shows that the film is polycrystalline cubic (bcc) and has a preferential orientation in the (110) plane and increases with the thickness of the film. The Nb stress first increases with the increase of film thickness, reaching the maximum at 200 nm (1.0151 GPa), and then decreases with the increase of film thickness.
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