直写技术（direct writing）作为新一代快速成型技术，具有成型速度快、成型一致性好、制备精度高等优点，在微机电（Micro Electro Mechanical Systems，MEMS）含能器件的制备上具有一定优势。本文阐述了MEMS含能器件常用的直写技术，在此基础上，针对直写技术在微纳含能器件中的研究现状，对MEMS装药、发火电路与换能元以及封装材料的直写技术进行了总结。提出了今后的研究重点：制备固含量高、性能稳定的含能墨水，提高含能墨水装药密度；制备低烧结温度的银油墨电路，同时发展MEMS含能器件换能元与封装材料的直写技术，探究直写精度的影响因素与规律，突破直写技术的应用瓶颈，推动MEMS含能器件的工程化应用进度。“,”As a new generation of rapid prototyping technology， direct writing technology has the advantages of fast molding speed， good molding consistency， and high preparation accuracy. It has certain advantages in the preparation of MEMS energetic devices. In this paper， the common direct writing technologies of MEMS energetic devices were described. On this basis， according to the research status of direct writing technology in micro‑nano energetic devices， the direct writing technologies used in micro‑scale charges of MEMS energetic devices， ignition circuit and transducer element， and packaging materials were summarized. The future research directions were proposed： preparing energetic ink with high solid content and stable performance， increasing the charge density of energetic ink， preparing silver ink circuit with low sintering temperature， and at the same time developing direct writing technology for MEMS energetic device transducers and packaging materials， exploring the influencing factors and laws of direct writing accuracy， breaking through the application bottleneck of direct writing technology， and promoting the progress of engineering application of this technology.