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在利用磁控溅射方法制作用于ＩＣ的镍铬薄膜电阻过程中，发现在对薄膜热处理时薄膜的电阻特性发生了有规律的变化，这种变化不是单纯的线性增大或减小。针对这种现象，我们经过分析认为，由于金属膜薄的电阻率不同于块状金属的电阻率，已不是定值，它与金属膜厚有着一定的关系，而热处理所产生的凝聚效应、氧化效应、和稳态效应对不同厚度的薄膜电阻率的影响程度是不一样的，因此电阻经热处理后的变化值最终表现出不同的变化趋势。这一现象的发现对我们今后在ＩＣ镍铬合金薄膜电阻的设计优化方面具有较高的参考意义。
During the fabrication of NiCr thin film resistors for ICs by magnetron sputtering, it was found that the resistance characteristics of the films changed regularly during the heat treatment of the thin film. This change was not a simple linear increase or decrease. In response to this phenomenon, we have analyzed that as the thin metal film resistivity different from the bulk metal resistivity is not a constant value, it has a certain relationship with the metal film thickness, and the heat treatment of the cohesive effect of oxidation Effect of the effect and steady-state effect on the resistivity of the different thickness of the film is not the same degree of influence, so the value of the resistance after heat treatment eventually showed different trends. The discovery of this phenomenon is of high reference significance for the future design optimization of IC nichrome thin film resistors.