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球栅阵列封装具有高密度、低成本的特点被内存领域广泛采用。在实际的使用过程中由于遭受外界各种形式的机械负载和冲击造成器件失效,典型的失效模式有5类,突出问题是焊点失效,而焊点破裂是失效的主要形式。为了改善焊点的强度,提出了焊球的快速剪切测试以及BGA器件的快速剪切测试方法来检测焊点强度,设计了4种不同金属层结构的基板焊盘,对比了不同基板焊盘的快速剪切强度和失效模式。通过数据分析和失效模式研究,证明含较厚铜层或者镍层的焊盘具有更强的焊接强度。
Ball grid array package with high-density, low-cost features are widely used in the field of memory. There are five typical failure modes due to various forms of mechanical load and shock in the actual process. The outstanding problem is the failure of the solder joint, and the rupture of the solder joint is the main form of failure. In order to improve the strength of the solder joints, a rapid shearing test of solder balls and a fast shear test method of BGA devices are proposed to test the solder joint strength. Four kinds of substrate pads with different metal layer structures are designed and compared with different substrate pads Fast shear strength and failure mode. Through data analysis and failure mode studies, it has been demonstrated that pads with thicker copper layers or nickel layers have greater weld strength.