论文部分内容阅读
安普公司推出了用声波焊接框架组件(Sonic Weld FrameKit)包装 PC 卡的解决方案。该组件包括一个超声波焊接密封系统,用一个超声波焊机将框架组件接在一起,不需逐个接合锁销。这种密封法具有改善扭转刚性、加强防破坏性和自动组装等特点。改善的扭转刚性可向 PC 卡提供更牢固的封装,内部 PC 板卡不易扭动;框架组件的抗破坏性可防止任意打开 PC 卡而暴露 PC 插件板和电子器件。安普
AMP has introduced a solution for packaging PC Cards with Sonic Weld FrameKit. The kit includes an ultrasonic welding seal system that uses an ultrasonic welder to join the frame assemblies together without locking pins. This seal method has the characteristics of improved torsional rigidity, enhanced destructiveness and automatic assembly. The improved torsional rigidity provides a more robust package for PC cards that are less prone to twisting; the destructible nature of the frame components prevents PC cards and electronics from being exposed by any open PC card. AMP