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研究了陶瓷介电常数、陶瓷加入量和陶瓷－聚丙稀复合薄膜介电性能间的关系，给出适合本陶瓷－聚丙烯复合系统的介电常数公式．提出的陶瓷颗粒包覆方法可有效提高复合膜的力学性能，使陶瓷粉加入量由４０％提高到５６％（ｖｏｌ％）．陶瓷颗粒包覆后，采用轧膜工艺制备出厚度为１００μｍ、力学性能优良、介电常数大于２０、介电损耗小于５０×１０－４、容量变化率小于４％的复合膜．还对包覆和未包覆陶瓷－聚丙烯复合膜的显微结构进行了研究．
The relationship between the dielectric constant of ceramics, the amount of ceramic added and the dielectric properties of ceramic - polypropylene composite films was studied. The dielectric constant formula suitable for the ceramic - polypropylene composite system was given. The proposed ceramic particle coating method can effectively improve the mechanical properties of the composite film, so that the amount of ceramic powder increased from 40% to 56% (vol%). After the ceramic particles are coated, a composite film with a thickness of 100 μm, excellent mechanical properties, a dielectric constant of more than 20, a dielectric loss of less than 50 × 10 -4, and a capacity change rate of less than 4% is prepared by a rolling film technique. The microstructures of coated and uncoated ceramic-polypropylene composite films were also investigated.