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本文中我们首次在这里公布近些年来我们对半导体材料及微电子器件进行无损显微分层内窥新方法(简称显微分层内窥法)的一些电子显微镜照片及研究结果。这个方法目前已可应用到对半导体材料的亚表面层内的微结构和缺陷进行检测。亚表面层内的微结构状况和缺陷的有无及多少,将直接
For the first time in this article, we publish some electron micrographs and the results of our recent research into a new method of non-destructive microscopic endoscopy of semiconductor materials and microelectronic devices (microscopic layered endoscopy). This method has now been applied to the detection of microstructures and defects in the subsurface layers of semiconductor materials. Sub-surface layer of microstructural conditions and defects of the presence and amount will be direct