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本文叙述一项名为“用于有源设备中的电子元器件(EfA)”的合作研究项目的一些研究成果。采用内燃机的冷却线路对功率电子设备进行冷却,内燃机的温度能达到105℃(最恶劣情况能达到125℃)。所以,功率器件必须能经受住高达200℃的高温。挑战性的主要指标是功率循环能力。随着封装工艺的改进,这个目标是能够实现的。采用系统功率循环试验激发各种失效模式,并评估所采取的改进措施的效果。已发现,当采用新的内互连工艺,功率循环寿命能提高100倍之多。
This article describes some of the research results of a collaborative research project entitled “Electronic Components for Active Devices (EfA)”. The cooling circuit of the internal combustion engine is used to cool the power electronic equipment. The temperature of the internal combustion engine can reach 105 ℃ (the worst case can reach 125 ℃). Therefore, the power device must be able to withstand high temperatures up to 200 ℃. The main challenge is the power cycle capability. With the improvement of packaging technology, this goal can be achieved. System power cycling tests were used to stimulate various failure modes and evaluate the effectiveness of the improvement measures taken. It has been found that when a new interconnect technology is used, the power cycle life can be increased by 100 times.