一、ST公司在3G多模式的能力 ST公司在世界半导体市场排名第六,亚太地区排名第三,目前正在开发用于3GFDD/TDD,TDSCDMA和GSM/GPRS多模式移动系统的一系列平台。这些平台将会把应用开发和完全集成的基带,RF和协议堆栈子系统组合成一个整体。这会给移动手机开发商和制造商提供一种能适应长远发展目标的、能无缝地开发出最后可以用系统级芯片(SoC)来解决的、不同产品的能力。 First, the ST multi-mode capabilities in 3G ST company ranked sixth in the world semiconductor market, ranked third in the Asia Pacific region, is currently being developed for 3GFDD / TDD, TDSCDMA and GSM / GPRS multi-mode mobile system, a series of platforms. These platforms will combine application development and fully integrated baseband, RF and protocol stack subsystems into a single unit. This will give mobile handset developers and manufacturers the ability to adapt seamlessly to the long-term goal of seamlessly developing different products that can eventually be addressed with system-on-chip (SoC).