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一、前言 自从六十年代初开始出现塑料封装的半导体器件以来,由于优点突出,发展很快,国外报导的封装材料很多,但至今国外用于生产的塑料材料,以硅酮及环氧树脂为主。 在毛主席“独立自主、自力更生”的伟大方针指引下,为了满足飞跃发展的我国社会主义建设和国防工业需要,北京电子管厂和中国科学院化学所协作,从73年9月开始,进行了使用1.2—结构聚丁二烯树脂(以下简称聚丁二烯树脂)封装小功率晶体管试验。在共同努力下,于74年11月按部颁二级军用标准进行考核,通过了鉴定,并投入批量生产。其间,锦州晶体管厂在74年5月进行了聚丁二烯树脂封装及合成树脂等实验,也获得了成功,目前已正式投入生产。
I. Introduction Since the plastic packaging semiconductor devices began to appear in the early 1960s, due to their advantages and rapid development, there are many packaging materials reported in foreign countries. However, the plastic materials used in foreign countries so far have the advantages of using silicones and epoxy resins as the Lord. Under the guidance of Chairman Mao's great principle of “independence and self-reliance”, in order to meet the rapid development of China's socialist construction and national defense industry needs, the Beijing Electronic Tube Plant and the Chinese Academy of Sciences Institute of Chemistry in collaboration from September 73 onwards, the use of 1.2- Structure polybutadiene resin (hereinafter referred to as polybutadiene resin) package low-power transistor test. In joint efforts, in November 74, according to ministerial second-level military standards assessment, passed the appraisal, and put into mass production. In the meantime, Jinzhou transistor factory in May 74 carried out polybutadiene resin encapsulation and synthetic resin experiment, also obtained the success, now officially put into production.